Trump declared a bold move of a 25% tariff on all imported automobiles and light trucks, set to take effect on April 2nd. The stated aim? To revitalize domestic manufacturing and steer car production back to US soil. "This will continue to spur growth like you haven't seen before," Trump asserted, painting a picture of economic prosperity fueled by these tariffs. He also floated the idea of a tax deduction for auto loan interest, a perk reserved solely for those purchasing American-made vehicles, a move that would largely benefit wealthier Americans.  The financial implications were a point of contention. Trump optimistically projected a revenue windfall of $600 billion to $1 trillion, earmarked for reducing the national debt. His staff, however, offered a more tempered estimate, predicting around $100 billion.  While the administration argued that these measures would ultimately bolster American manufacturing, the immediate impact on consumers was clear: higher prices, potential financial strain, and the looming threat of escalating trade tensions. The narrative became one of a trade gamble, with the American consumer bearing a significant portion of the risk.  The impact wouldn't be limited to individual consumers. A ripple effect was anticipated, with potentially reduced car sales and a drag on overall economic growth. Furthermore, the proposed tax deduction for auto loan interest, intended to sweeten the deal for buying American, was seen as largely benefiting high-income earners, leaving low- and middle-income families with little relief. 

Scientists from the Department of Materials Science and Engineering in the NUS College of Design and Engineering have developed a state-of-the-art 3D printing technique - CHARM3D - which enables the fabrication of high-performance, self-healing 3D electronic circuits for healthcare, communications, and security applications.  This innovation directly addresses the limitations of traditional 3D circuit manufacturing, particularly Direct Ink Writing (DIW), by employing Field's metal, an eutectic alloy, instead of conventional composite inks.  The core problem solved is the inefficient, slow, and limited capability of DIW, which suffers from low conductivity, the need for support materials, and viscous inks. CHARM3D, leveraging Field's metal's low melting point and high conductivity, enables the creation of free-standing, complex 3D metallic structures without support materials or external pressure. This results in a significantly faster printing process (up to 100 mm/s), higher resolution, and the elimination of post-treatment steps.  -- The team effectively applied TRIZ principles by identifying and resolving contradictions present in the existing technology. They overcame the physical contradiction of needing both support and no support during printing, and the contradiction of needing high and low viscosity in the printing material. They utilized Fields' metal, which melts at a low temp, allowing for rapid solidification and eliminating the need for support, thereby resolving the contradictions.

The resulting 3D circuits exhibit self-healing capabilities and structural retention, opening up a wide range of applications, including:

• Healthcare: Contactless vital sign monitoring devices, improving patient comfort and enabling continuous monitoring.
• Signal Sensing: Optimized 3D antennas for improved communication systems, more accurate medical imaging (like microwave breast imaging), and robust security applications.
• Wearable Technology: Battery-free temperature sensors and other wearable devices.
• Advanced Electronics: Miniaturized and enhanced electronic components for various devices.

China’s push for semiconductor independence has been growing since 2014, as the country seeks to make strides in this critical field. At the heart of this effort is SMIC (Semiconductor Manufacturing International Corporation), China’s leading semiconductor manufacturer, which faces stiff competition from ASML, that dominates the global market for photolithography equipment currently. In an effort to close this technological gap, the Chinese government is investing heavily in key companies like SMIC, Hua Hong Semiconductor, Naura Technology Group, and Advanced Micro-Fabrication Equipment. The aim is clear: to develop a domestic alternative to ASML’s lithography systems and ensure a resilient semiconductor supply chain. China’s $41 billion investment is a clear indication of its intent to disrupt the established order of the semiconductor industry. While its efforts may not immediately challenge ASML’s state-of-the-art technology, the scale of China’s push underscores the strategic importance of semiconductor self-sufficiency in today’s global economy. As Western nations continue to restrict China’s access to the most advanced chipmaking technologies, the race for technological self-reliance is only set to intensify. If China’s investments succeed, they could reshape the semiconductor industry and have profound impacts on global supply chains and international relations. The big question remains: Can China catch up and bridge the technological gap in time to compete with the world’s most advanced chipmakers? Or will the technological divide continue to widen? Regardless of the outcome, it’s clear that the semiconductor race is far from over.

Senior foreign officials and major tech companies are pushing the Trump administration to rethink the country’s global semiconductor strategy, as the US prepares a controversial framework for controlling AI development worldwide.  The so-called AI diffusion rule restricts the number of AI processors that can be exported to others, prompting an outcry from tech giants like Nvidia after Biden officials unveiled it during their last week in office. US allies such as Israel and Poland have chafed at the rules, worrying it will threaten their supply of the precious chips or make their countries less attractive for AI investment.  The deadline for compliance arrives in less than two months. Administration officials are nowhere near a consensus on how to proceed. If Trump officials choose to maintain the framework as written, it could reshape digital infrastructure plans in regions key to the US-China competition, and pose particular challenges for companies like Oracle that are expanding aggressively in foreign markets. It also could turn access to US hardware into a geopolitical bargaining chip, in one of the most significant examples of American technological statecraft in the AI age.  Key Trump officials have indicated they want to streamline and strengthen the rule, what that means in practice remains in flux. Some officials, for example, have floated the idea of scrapping the 3 tiers and associated compute caps — but sticking with the baseline requirement of export licenses for most of the world, builds on previous limits for China and some 40 other countries. Some want narrower changes like requiring licenses for smaller shipment sizes instead of the framework’s current standard of government notification