Low PIM
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Antenna grade laminates reduce PIM, lower insertion loss - Electronic Products & Technology

Antenna grade laminates reduce PIM, lower insertion loss - Electronic Products & Technology | Low PIM | Scoop.it
Antenna grade laminates reduce PIM, lower insertion loss Electronic Products & Technology RO4700JXR Series antenna grade laminates combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion...
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Low PIM Loads | AGL (Above Ground Level)

Low PIM Loads | AGL (Above Ground Level) | Low PIM | Scoop.it
Low PIM Loads. Tuesday, 23 April 2013 13:10: J. Sharpe Smith: 0 Comments. MECA Electronics has launched its low passive intermodulation loads/terminations with -170dBc (typical) passive intermodulation from 698 MHz to 2700 MHz.
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In-Building Community Blog » Maximizing Network Capacity by Minimizing Passive Intermodulation (PIM)

In-Building Community Blog » Maximizing Network Capacity by Minimizing Passive Intermodulation (PIM) | Low PIM | Scoop.it
A new blog on iBwave: Maximizing Network Capacity by Minimizing Passive Intermodulation (PIM). http://t.co/YNRzeDC61z #DAS #Wireless
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Low-PIM, High-Power Loads/Terminations | AGL (Above Ground ...

Low-PIM, High-Power Loads/Terminations | AGL (Above Ground ... | Low PIM | Scoop.it
Low-PIM, High-Power Loads/Terminations. Monday, 13 May 2013 10:09: J. Sharpe Smith: 0 Comments. MECA Electronics launched its line of low PIM terminations/loads with -170dBc (typical) passive intermodulation from 698 – 2700 MHz.
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Prologix To Demonstrate Service Assurance, Wireless, Optical And Test ... - Test and Measurement.com (press release)

Prologix To Demonstrate Service Assurance, Wireless, Optical And Test ...
Test and Measurement.com (press release)
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DOCSIS 3.1: Coping With Design Gotchas Before Rollout - EE Times

DOCSIS 3.1: Coping With Design Gotchas Before Rollout - EE Times | Low PIM | Scoop.it
DOCSIS 3.1: Coping With Design Gotchas Before Rollout
EE Times
However, digital-filtering techniques can be employed on the receiver to reduce the bill-of-materials of these diplexers.
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